Importance

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Abstract

A manufacturing method of the package carrier includes the following steps. A circuit substrate having a through via is provided. A heat-conducting material layer coving the inner wall of the through via is electroplated on the circuit substrate. A first build-up structure and a second build-up structure are respectively formed on two opposite sides of the circuit substrate. Parts of the first build-up structure, the circuit substrate, the heat-conducting material layer and the second build-up structure are removed to expose the remaining heat-conducting material layer, so as to define a heat-conducting element and form a circuit structure layer including a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conducting portion is aligned with a side surface of the circuit structure layer.

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First Claim