ACOUSTIC WAVE DEVICES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250038735A1
SERIAL NO

18788136

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Abstract

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An acoustic wave device that has a better TCF and can improve a resonator Q or impedance ratio is provided. The acoustic wave device includes a substrate 11 containing 70 mass % or greater of silicon dioxide (SiO2), a piezoelectric thin film 12 including LiTaO3 crystal or LiNbO3 crystal and disposed on the substrate 11, and an interdigital transducer electrode 13 disposed in contact with the piezoelectric thin film 12.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KADOTA, Michio Sendai-shi, JP 199 6995
TANAKA, Shuji Sendai-shi, JP 148 947

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