SEMICONDUCTOR PACKAGE
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Apr 30, 2024
filing date -
Apr 30, 2024
priority date (Note) -
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Abstract
A semiconductor package includes a first redistribution structure comprising a plurality of first redistribution layers. A second redistribution structure is above the first redistribution structure. The second redistribution structure comprises a plurality of second redistribution layers. A first semiconductor chip is on the first redistribution structure and is arranged between the first redistribution structure and the second redistribution structure. A conductive block directly contacts the first redistribution structure and the second redistribution structure and extends in a horizontal direction between the first redistribution structure and the second redistribution structure. A plurality of conductive posts is around the first semiconductor chip and the conductive block. The plurality of conductive posts extends in a vertical direction and directly contacts the first redistribution structure and the second redistribution structure.
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