ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING AND ELECTRONIC APPARATUS
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Sep 26, 2023
filing date -
Sep 26, 2023
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Abstract
Embodiments of the present disclosure provide an electronic packaging, a manufacturing method for an electronic packaging and an electronic apparatus. The electronic packaging includes a package substrate and an interconnect substrate, wherein a first surface of the package substrate is provided with a recess in which the interconnect substrate is embedded; and a bottom of the interconnect substrate is provided with a first heat sink; the first surface of the package substrate is provided with a first die and a second die; the first die and the second die are electrically connected through the interconnect substrate.
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