PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Oct 18, 2024
filing date -
Oct 18, 2024
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Abstract
In a method of manufacturing a packaging unit, a material layer is stacked for forming the semiconductor device on one surface of a substrate, a semiconductor device is formed by performing a semiconductor process on the material layer, a flow channel through which a cooling fluid flows is formed on the other surface of the substrate to enable direct cooling of the semiconductor device using the cooling fluid, a packaging block is disposed at a position spaced apart from the substrate for packaging of the semiconductor device, and an electrode placed on the packaging block is electrically connected to the semiconductor device, and a heat sink unit having a flow path forming portion in which a flow path communicating with the flow channel of the substrate is formed is arranged below the packaging block, and the substrate is combined with the heat sink unit.
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