CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING METHOD THEREOF
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Aug 15, 2023
filing date -
Aug 15, 2023
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Abstract
Implementations of chip packaging structures, semiconductor structures and fabricating methods thereof are disclosed. A chip packaging structure comprises a substrate comprising: a signal transmitting wiring structure embedded in the substrate, and a thermal transmitting wiring structure embedded in the substrate. The chip packaging structure further comprises a first chip on the substrate and electrically connected with the signal transmitting wiring structure. The chip packaging structure further comprises at least one thermal conductive structure on the substrate, in thermal contact with the thermal transmitting wiring structure, and laterally surrounding the first chip.
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