Importance

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Abstract

A modular interconnection unit, a semiconductor package and a method for making the same are provided. The method includes: providing a first sub-package including a first substrate, at least one first interconnection pattern, and at least one first electronic component; mounting at least one modular interconnection unit on the first substrate, wherein the modular interconnection unit includes a dielectric layer, at least one conductive via passing through the dielectric layer, at least one conductive bump raised from an upper surface of the dielectric layer, and a protection layer covering the conductive bump and having a flat upper surface, and the conductive via is electrically coupled with the first interconnection pattern; forming a first encapsulant on the upper surface of the first substrate; removing a portion of the protection layer to expose an upper surface of the conductive bump; and mounting a second sub-package above the first encapsulant.

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First Claim