EXTREME ULTRAVIOLET LITHOGRAPHY METHOD AND EUV PHOTOMASK

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250036021A1
SERIAL NO

18360853

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Abstract

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An attenuated phase-shifting mask (APSM) includes a substrate, a multi-layer structure, a capping layer and an absorber layer. The substrate has a first side and a second side opposite to the first side. The multi-layer structure is disposed over the first side of the substrate. The capping layer is disposed over the multi-layer structure. The absorber layer is disposed over a portion of the capping layer. The absorber layer includes a first material and a second material different from the first material. A thickness of the absorber layer is between approximately 30 nm and approximately 65 nm. A refractive index (n) of the absorber layer is between approximately 0.860 and approximately 0.945. An extinction coefficient (k) of the absorber layer is between approximately 0.070 and approximately 0.015.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, LEE-FENG NEW TAIPEI CITY, TW 2 0
CHEN, YEN-LIANG HSINCHU COUNTY, TW 75 337
LEE, CHIEN-MIN HSINCHU COUNTY, TW 210 1319
LIN, SHY-JAY HSINCHU, TW 142 982
TAI, KUO LUN HSINCHU CITY, TW 2 0

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