INTEGRATED LIQUID COOLING HEAT DISSIPATION DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250035383A1
SERIAL NO

18236855

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An integrated liquid cooling heat dissipation device includes a liquid cooling radiator including first and second liquid boxes and a heat dissipation pipe set, a liquid cooling head and a liquid pump. The first liquid box forms an upper box body part and a lower box body part that is combined with the heat dissipation pipe set, so that the liquid collection space in the first liquid box is changed below the first liquid box, thereby reducing the height of the upper box body part. The upper box body part and the second liquid box protrude from the front and back of the heat dissipation pipe set, forming a fan installation space at the front and back of the liquid cooling radiator, so that the fan can simultaneously supply air to the heat dissipation pipe set and lower box body part to dissipate heat.

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Patent Owner(s)

Patent OwnerAddress
HUANG TSUNG HSIENNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUANG, Tsung-Hsien I-Lan Hsien, TW 104 420

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