SELF CORRECTING OVEN TECHNOLOGY
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Dec 7, 2022
filing date -
Dec 7, 2022
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Abstract
A reflow soldering oven for soldering and/or bonding component leads both electrically and mechanically to pads on a PCB in an SMT manufacturing system. The soldering oven includes at least one thermal infrared camera that generates thermal images of the PCB to provide thermal imaging processing to monitor and correct temperature deviations in real time. The oven generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling and to initiate changes like temperature control or the oven belt-speed monitoring to offer self-correcting capabilities.
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