LASER SOLDERING DEVICE WITH ADJUSTABLE LASER IRRADIATION POSITION AND SOLDERING METHOD COMPRISING SAME
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United States of America
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Issued Date -
Jan 30, 2025
app pub date -
Sep 20, 2022
filing date -
Sep 20, 2022
priority date (Note) -
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Abstract
The present invention provides a laser soldering apparatus and a soldering method, the laser soldering apparatus including: a solder unit for forming a bonding surface by performing the soldering by a laser beam, and comprising at least one nozzle unit for accommodating a solder ball to which the laser beam is irradiated; and a monitoring unit arranged on one side of the solder unit to monitor the irradiation position of the laser beam, wherein the irradiation position of the laser beam irradiated from the solder unit is adjusted to be irradiated to the central point of the nozzle unit or the solder ball according to the monitoring result of the monitoring unit.
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