FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Jul 28, 2023
filing date -
Jul 28, 2023
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Abstract
A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a first dielectric layer, a second dielectric layer disposed on the first dielectric layer, a signal layer disposed within the second dielectric layer, a third dielectric layer disposed on the second dielectric layer, and liquid metal composites. The signal layer includes a trace and a pad. The liquid metal composites are disposed to surround the trace, but not enclose the pad, thereby satisfying requirements of the signal layer for great bending numbers and high frequency signal transmission.
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