SUBSTRATE SUPPORTING MEMBER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Dec 19, 2023
filing date -
Dec 19, 2023
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Abstract
A substrate supporting member and a substrate processing apparatus including the same are provided. The substrate supporting member includes a plate having at least one heating zone. A heating member is on a first surface of the plate and located in the at least one heating zone. The heating member extends along a circumferential direction of the plate and is configured to heat a substrate supported by the plate. A first electrode is on the first surface of the plate and is connected to an inner side surface of the heating member. A second electrode is on the first surface of the plate and is connected to an outer side surface of the heating member. The heating member has a stair-step configuration such that a thickness of the heating member increases from the second electrode toward the first electrode.
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