SURFACE ACOUSTIC WAVE DEVICE HAVING IMPROVED Q PERFORMANCE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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N/A
Issued Date -
Jan 23, 2025
app pub date -
Jul 7, 2024
filing date -
Jul 7, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A Surface Acoustic Wave (SAW) device having improved Q performance and high reliability of a bonding unit and a method of manufacturing the same are provided. The surface acoustic wave device includes a support substrate; a high sound velocity layer formed on the support substrate; a first low sound velocity layer formed on the high sound velocity layer; a second low sound velocity layer formed on the first low sound velocity layer; a piezoelectric plate formed on the second low sound velocity layer; and a plurality of IDT electrode fingers formed on the piezoelectric plate, and the sound velocity of the first low sound velocity layer and the sound velocity of the second low sound velocity layer are different from each other.
First Claim
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