NESTING ATMOSPHERIC ROBOT ARMS FOR HIGH THROUGHPUT
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Nov 9, 2022
filing date -
Nov 9, 2022
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Abstract
Nesting wafer handling robot arms are provided that may be used to move semiconductor wafers between various wafer placement locations in a semiconductor processing tool. The nesting wafer handling robot arms may be configured so that each wafer handling may be able to translate along a translation system and pick and place wafers independent of what the other wafer handling may be doing. The two wafer handling robot arms may enter a nesting configuration so that each wafer handling robot may concurrently pick or place wafers from wafer placement locations where one wafer placement location is directly above the other.
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