METHODS OF ANALYZING UNIFORMITY, AND RELATED APPARATUS AND SYSTEMS, FOR SEMICONDUCTOR MANUFACTURING
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Jul 21, 2023
filing date -
Jul 21, 2023
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Abstract
The present disclosure relates to methods of analyzing uniformity for substrate processing, and related apparatus and systems, for semiconductor manufacturing. In one or more embodiments, a non-uniformity is indicated, and the non-uniformity is a temperature non-uniformity and/or a physical non-uniformity. In one or more embodiments, a signal profile is accepted or rejected. In one or more embodiments, a method of analyzing uniformity for substrate processing applicable for semiconductor manufacturing includes heating an internal volume of a processing chamber using a target value. The method includes rotating a substrate support, and scanning, while rotating the substrate support, a sensor across one or more sections to take a plurality of readings. The method includes generating a signal profile including the plurality of readings, and analyzing the signal profile by comparing the signal profile to a range.
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