Conductive particle, conductive materials and connection structure
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Jul 19, 2024
filing date -
Jul 19, 2024
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Abstract
A conductive particle to be dispersed in a resin composition of an anisotropic connection material containing binder resin and solvent, the conductive particle includes: a core, a conductive layer provided on the core and containing metal, insulating fine particles connected by a first substituent that binds to the metal of the conductive layer, provided on a first region of the conductive layer, and a hydrophobic surface treatment layer connected by a second substituent that binds to the metal of the conductive layer, provided on a second region of the conductive layer, wherein the first region and the second region do not overlap.
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