DEVICE OF INSPECTING DEFECTS OF WAFER DICED OR ALIGNED
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Feb 27, 2024
filing date -
Feb 27, 2024
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status (Latency Note)
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Abstract
A device of inspecting defects of a wafer diced or aligned, the wafer including, after being diced or aligned, a silicon wafer layer and a blue film affixed to the bottom of the silicon wafer layer, the device including: an immersion liquid detector having a casing, the casing having a transparent lid, allowing a liquid to flow through and fill between the blue film and the transparent lid; a lens assembly disposed in the casing and below the transparent lid; an optical lens assembly disposed in the casing and below the lens assembly; a light source for generating visible light and infrared light; and a visible-light camera and an infrared camera, both adapted to perform imaging on the bottom of the silicon wafer layer.
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