HEAT SUPPLY APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20250027677A1
SERIAL NO

18775751

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and having a plurality of pipes exchanging heat between refrigerant and air, wherein the plurality of pipes include: a first pipe disposed in the lowermost part; and the second pipes disposed above the first pipe, wherein the first pipe directs refrigerant flow in the opposite direction to the refrigerant flow in the remaining pipes.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
LG ELECTRONICS INC128 YEOUI-DAERO YEONGDEUNGPO-GU SEOUL 07336 REPUBLIC OF KOREA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HA, Doyong Seoul, KR 32 48
KIM, Hyunjong Seoul, KR 25 34
KWON, Kyongmin Seoul, KR 12 59
OH, Seungtaek Seoul, KR 25 51
SHIN, Jeongseob Seoul, KR 13 6

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