FLUX AND SOLDER PASTE COMPRISING SAID FLUX
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Jul 15, 2024
filing date -
Jul 15, 2024
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Abstract
A flux consisting of, (i) 30 to 80 wt. % of one or more acidic resins, (ii) 10 to 60 wt. % of at least one organic solvent, (iii) 0 to 15 wt. % of one or more amines, and (iv) 0 to 20 wt. % of one or more components other than components (i) to (iii), wherein the flux undergoes a weight loss of ≥50 wt. % upon reaching a temperature of 280° C. during a thermogravimetric analysis carried out in the range from 25 to 350° C. at a heating rate of 10 K/min and with the addition of synthetic air; and solder paste consisting of 80 to 92 wt. % of one or more different solders and 8 to 20 wt. % of the flux.
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