HOLLOW PARTICLES, RESIN COMPOSITION, AND RESIN MOLDED BODY
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United States of America Patent
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Issued Date -
Jan 23, 2025
app pub date -
Dec 7, 2022
filing date -
Dec 7, 2022
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Abstract
To provide hollow particles configured to be low in dielectric dissipation factor at high frequencies. Hollow particles which comprise a shell containing a resin and a hollow portion surrounded by the shell, wherein a void ratio of the hollow particles is 50% or more; wherein, as the resin, the shell contains a polymer which contains 91% by mass or more of hydrocarbon monomer units and 50% by mass or more of crosslinkable monomer units; wherein at least a part of the hydrocarbon monomer units are crosslinkable hydrocarbon monomer units; wherein a residual double bond ratio of the polymer is 30.0% or less; and wherein a dielectric dissipation factor of the hollow particles at a frequency of 10 GHz is 3.00×10−3 or less.
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