Component Carrier and Method for Manufacturing the Same Using a Desmear Process
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United States of America
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Issued Date -
Jan 16, 2025
app pub date -
Mar 18, 2024
filing date -
Mar 18, 2024
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Abstract
A component carrier including a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The at least one electrically insulating layer structure includes i) an insulating material, and ii) fillers embedded in the insulating material. At least one of said fillers is exposed at one of the main surfaces of the electrically insulating layer structure. The at least one exposed filler includes a high-roughened surface portion and a low-roughened surface portion.
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