PRINTED CIRCUIT BOARD
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United States of America
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Issued Date -
Jan 16, 2025
app pub date -
May 7, 2024
filing date -
May 7, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes a substrate portion including a first insulating layer, and a first wiring layer disposed on or in the first insulating layer, and a connection structure disposed on or in the substrate portion, the connection structure including a plurality of first dielectric layers, first and second metal layers respectively disposed on the plurality of first dielectric layers, a second insulating layer disposed on the plurality of first dielectric layers, and a second wiring layer disposed on the second insulating layer. Each of the plurality of first dielectric layers includes an organic material. A distance between the first metal layer and the second metal layer is less than a distance between the first metal layer and the second wiring layer.
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