CIRCUIT BOARD
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United States of America
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Issued Date -
Jan 16, 2025
app pub date -
Nov 29, 2022
filing date -
Nov 29, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board according to an embodiment includes a first insulating layer; a first pattern layer disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on the upper surface of the first insulating layer and an upper surface of the first pattern layer and including a cavity, wherein the upper surface of the first insulating layer includes a first upper surface corresponding to a lower surface of the cavity, and a second upper surface having a step difference from the first upper surface and not vertically overlapping the lower surface of the cavity, wherein the first pattern layer includes a first pattern part disposed on the first upper surface, and a second pattern part disposed on the second upper surface, and wherein a thickness of the first pattern part is smaller than a thickness of the second pattern part.
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