SYSTEM FOR ENCAPSULATING A SURFACE ELASTIC WAVE DEVICE
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Jan 16, 2025
app pub date -
Nov 2, 2022
filing date -
Nov 2, 2022
priority date (Note) -
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Importance

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Abstract
A compact and robust encapsulation system for protecting a surface wave device comprises a SAW device and a sealing joint, which seals a second substrate to the base substrate of the SAW device so as to form a cavity, and an antenna connection means arranged outside the cavity on the encapsulation system.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SOITEC | BERNIN |
International Classification(s)

- 2022 Application Filing Year
- H03H Class
- 1102 Applications Filed
- 415 Patents Issued To-Date
- 37.66 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Aspar, Gabrielle | Besançon, FR | 1 | 0 |
# of filed Patents : 1 Total Citations : 0 | |||
Ballandras, Sylvain | Besançon, FR | 53 | 131 |
# of filed Patents : 53 Total Citations : 131 | |||
Bernard, Florent | Besançon, FR | 16 | 21 |
# of filed Patents : 16 Total Citations : 21 | |||
Courjon, Emilie | Franois, FR | 16 | 6 |
# of filed Patents : 16 Total Citations : 6 | |||
Laroche, Thierry | Besançon, FR | 22 | 14 |
# of filed Patents : 22 Total Citations : 14 |
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Patent Citation Ranking
- 0 Citation Count
- H03H Class
- 0 % this patent is cited more than
- < 1 Age
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Fee | Large entity fee | small entity fee | micro entity fee | due date |
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3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jul 16, 2028 |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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