METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Jan 16, 2025
app pub date -
Oct 1, 2024
filing date -
Oct 1, 2024
priority date (Note) -
Published
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Importance

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Abstract
A method for debonding a wafer from a bonded wafer stack is disclosed. Initially, a light-absorbing layer is placed on a carrier. A wafer is then attached to the light-absorbing layer of the carrier via an adhesive layer to form a bonded wafer stack. After processing the wafer has been processed, a light pulse from a flashlamp is applied to a non-wafer side of the carrier to heat the light-absorbing layer and the adhesive layer in order to loosen the wafer from the bonded wafer stack. Finally, the wafer is removed from the bonded wafer stack.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
PULSEFORGE INC | AUSTIN TX |
International Classification(s)

- 2024 Application Filing Year
- H01L Class
- 12855 Applications Filed
- 458 Patents Issued To-Date
- 3.57 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Attar, Vahid Akhavan | Austin, US | 10 | 2 |
# of filed Patents : 10 Total Citations : 2 | |||
Turkani, Vikram S | Austin, US | 4 | 0 |
# of filed Patents : 4 Total Citations : 0 |
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- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- < 1 Age
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