SEMICONDUCTOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250022791A1
SERIAL NO

18901920

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Abstract

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Provided is a semiconductor device including: a first wiring layer; a holding layer; a semiconductor element that is disposed between the first wiring layer and the holding layer and includes at least a semiconductor layer and a first electrode disposed on a first surface of the semiconductor layer; an insulator in which at least a part of the semiconductor element is embedded; and a first connecting portion that electrically connects the first wiring layer and the first electrode, wherein a connection area between the first connecting portion and the first electrode occupies 45% or more of an area of an exposed part of the first electrode.

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Patent Owner(s)

Patent OwnerAddress
FLOSFIA INCKYOTO 615-8245

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KONDO, Hiroshi Kyoto, JP 228 4905
NAKAZAWA, Tatsuhiro Kyoto, JP 27 158
SHINOHE, Takashi Kyoto, JP 171 1613
TAKEUCHI, Kengo Kyoto, JP 50 231

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