DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR
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United States of America
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Issued Date -
Jan 16, 2025
app pub date -
Jul 13, 2023
filing date -
Jul 13, 2023
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Abstract
A semiconductor die bonding device has a bond arm body, a collet attached at a first end of the bond arm body for holding a semiconductor die during a pick-and-place operation, and a voice coil actuator located at a second end of the bond arm body for driving the bond arm body to rotate about a pivot positioned between the collet and the voice coil actuator. The voice coil actuator includes a pair of arc magnets having concave arced surfaces facing the pivot that form an arc-shaped gap between the arc magnets, and an arc coil including a concave arced surface disposed within the arc-shaped gap that is configured to be movable relative to the arc magnets.
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