Importance

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Abstract

According to an aspect of the disclosure, a method of manufacturing a substrate having a semiconductor chip receiving recess formed therein, includes preparing a copper-clad laminate having, on at least one surface thereof, a copper-clad layer, forming a first plating pattern on one surface of the copper-clad layer so as to correspond to a position at which the semiconductor chip receiving recess is to be formed, forming a second plating pattern on one surface of the first plating pattern and one surface of the copper-clad layer, arranging an insulating layer to cover the first plating pattern and the second plating pattern, and forming the semiconductor chip receiving recess by removing a portion of the copper-clad layer, on which the first plating pattern is arranged, and the first plating pattern.

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First Claim