COPPER ALLOY WIRE, COVERED WIRE, COVERED WIRE WITH TERMINAL, AND METHOD FOR MANUFACTURING COPPER ALLOY WIRE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250022628A1
SERIAL NO

18684460

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Abstract

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Disclosed herein is a copper alloy wire being a wire rod formed of a copper alloy and having a tensile strength of 400 MPa or more, an elongation at break of 5% or more, a conductivity of 60% IACS or more, and a wire diameter of 0.5 mm or less, wherein the copper alloy has a composition containing 0.05% by mass or more and 1.6% by mass or less of iron, 0.01% by mass or more and 0.7% by mass or less of phosphorus, and 0.05% by mass or more and 0.7% by mass or less of tin with the balance being copper and unavoidable impurities, the copper alloy has a structure containing crystals, and a crystal grain size difference determined as a difference between a maximum crystal grain size and a minimum crystal grain size in a cross-section is 1.0 μm or less.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO WIRING SYSTEMS LTD1-14 NISHISUEHIRO-CHO YOKKAICHI-SHI MIE 510-8503
SUMITOMO ELECTRIC INDUSTRIES LTD5-33 KITAHAMA 4-CHOME CHUO-KU OSAKA-SHI OSAKA 541-0041
AUTONETWORKS TECHNOLOGIES LTD1-14 NISHISUEHIRO-CHO YOKKAICHI-SHI MIE 510-8503

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
EHARA, Kazuki Osaka-shi, JP 1 0
FUJITA, Hiroshi Osaka-shi, JP 287 3126
IMASATO, Fumitoshi Yokkaichi, JP 13 69
KUBO, Noriaki Osaka-shi, JP 7 81
KUWABARA, Tetsuya Osaka-shi, JP 75 282
OSHIMA, Yusuke Osaka-shi, JP 17 19
OTSUKA, Yasuyuki Yokkaichi, JP 58 290
SAKAMOTO, Kei Osaka-shi, JP 117 809
SHIMIZU, Sae Osaka-shi, JP 1 0
TSUNEDA, Hiroki Osaka-shi, JP 3 0

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