ADAPTIVE CHIP TESTING APPARATUS AND FORMATION METHOD THEREOF

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250020687A1
SERIAL NO

18433754

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Abstract

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The present disclosure provides an adaptive die testing apparatus and a formation method. The adaptive die testing apparatus includes a support frame capable of moving along a vertical direction; a movable panel capable of moving along a horizontal direction; an upper test socket installed on the support frame; and a lower test socket installed on the movable panel and capable of moving with the movable plate to directly below the upper test socket. A groove is formed on a lower surface of the upper test socket and/or an upper surface of the lower test socket. When the adaptive die testing apparatus is at a testing state, the lower surface of the upper test socket is in a close contact with the upper surface of the lower test socket, and a sealed chamber for placing a die to-be-tested is formed at a region of the groove.

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Patent Owner(s)

Patent OwnerAddress
SEMIGHT INSTRUMENTS CO LTDBUILDING 1 NO 1508 XIANGJIANG ROAD SUZHOU NEW DISTRICT SUZHOU 215000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HU, Haiyang Suzhou, CN 19 16
HUANG, Jianjun Suzhou, CN 30 53
LIAN, Zhe Suzhou, CN 10 0
WU, Yonghong Suzhou, CN 10 34
ZHAO, Shan Suzhou, CN 11 0

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