Importance

Loading Importance Indicators...

Abstract

In a holding surface correction processing step, a shape of a holding surface is corrected by an etching mechanism in such a manner as to have a surface shape similar to that of an upper surface of a test grinding wafer having been ground in a test grinding step. As a result, at a time of a grinding step, when a holding section of a chuck table communicates with a suction source and a product wafer is held under suction on the holding surface, the holding surface becomes a substantially flat surface, and a radius part of the holding surface becomes parallel to a lower surface of a wafer grinding grindstone. Hence, it is possible to prevent partial thickness differences from being generated in the product wafer having been ground by the wafer grinding grindstone.

Loading the Abstract Image...

First Claim