ULTRASONIC WELDING SYSTEM AND POWER MODULE PACKAGE FOR POWER CONVERTING APPARATUS TO WHICH SUBSTRATE WHERE CONNECTION MEMBER IS ULTRASONIC WELDED BY USING THE SAME IS APPLIED

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250018498A1
SERIAL NO

18442063

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Importance

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Abstract

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Provided is an ultrasonic welding system and a power module package for a power converting apparatus to which a substrate where connection members are ultrasonic welded by using the system is applied, wherein the ultrasonic welding system includes a waffle pack 110 on which connection members 10 to be ultrasonic welded onto a substrate 20 are arranged in a specific form, a centering aligning unit 120 which aligns and centers the connection members 10 transferred from the waffle pack 110, an ultrasonic welding part 130 which fixes the substrate 20 and ultrasonic welds the connection members 10 aligned by the centering aligning unit 120 onto the substrate 20, and a picker 140 which separately picks the connection members 10 from the waffle pack 110 to be transferred to the centering aligning unit 120 and re-picks the aligned connection members 10 from the centering aligning unit 120 to be transferred to ultrasonic welding positions on the substrate 20 fixed to the ultrasonic welding part 130, wherein the connection members 10 are aligned on a right position on the substrate 20 and are stood straight.

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Patent Owner(s)

Patent OwnerAddress
JMJ KOREA CO LTDBUSAN 46034

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Yun Hwa Busan, KR 47 32
PARK, Jung Min Bucheon-si, KR 90 669

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