MICROMACHINED ULTRASONIC TRANSDUCER DEVICE WITH HIGH QUALITY FACTOR
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United States of America
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Issued Date -
Jan 16, 2025
app pub date -
Jul 1, 2024
filing date -
Jul 1, 2024
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Abstract
Micromachined ultrasonic transducer wherein a die including semiconductor material accommodates at least one ultrasonic cell. Each ultrasonic cell includes a piezoelectric structure, a cavity, and a membrane region, vertically aligned with each other. The cavity extends inside the die and downwardly delimits the membrane region. The piezoelectric structure is arranged on the membrane region and has at least one annular-shaped piezoelectric region. The micromachined ultrasonic transducer is configured to operate around the second axisymmetric vibration mode.
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