COMPOSITION, MANUFACTURING METHOD FOR SEMICONDUCTOR ELEMENT, AND CLEANING METHOD FOR SEMICONDUCTOR SUBSTRATE

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United States of America

APP PUB NO 20250017209A1
SERIAL NO

18890032

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Abstract

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The present invention provides a composition that suppresses the occurrence of defects in an object to be applied, even in a case of being used after a predetermined period of time has elapsed from the production. In addition, the present invention provides a manufacturing method for a semiconductor element and a cleaning method for a semiconductor substrate.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 106-8620

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
INABA, Tadashi Haibara-gun, JP 79 534
Kamimura, Tetsuya Haibara-gun, JP 159 522
Muro, Naotsugu Haibara-gun, JP 49 193
Ouchi, Naoko Haibara-gun, JP 4 0

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