SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Jul 5, 2023
filing date -
Jul 5, 2023
priority date (Note) -
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Abstract
A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate, a transistor, and a capacitor. The transistor includes a gate electrode disposed on the substrate. The capacitor is electrically connected to the transistor and includes a capacitor dielectric and a capacitor electrode. The capacitor dielectric and the capacitor electrode are stacked over the gate electrode of the transistor.
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