SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Oct 17, 2023
filing date -
Oct 17, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate (e.g., a printed circuit board) for use in an integrated circuit package includes a first dielectric layer, a conductive coin embedded in the first dielectric layer, a first conductive layer formed on a first side of the first dielectric layer, a cavity in the first conductive layer, the cavity located over the conductive coin, and an embedded circuit component arranged in the cavity in the first conductive layer, wherein the embedded circuit component is located over the conductive coin and conductively coupled to the conductive coin. The substrate also includes a second dielectric layer formed over the first conductive layer, a second conductive layer formed over the second dielectric layer, and a via extending through the second dielectric layer, the via electrically connecting the second conductive layer to the embedded circuit component.
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