WIRING BOARD, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACTURING WIRING BOARD
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Jun 28, 2024
filing date -
Jun 28, 2024
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Abstract
A wiring board has a first principal surface including one or more first pads configured to bond an electronic component, one or more second pads configured not to bond another member, one or more wiring patterns connecting the one or more first pads to the one or more second pads, respectively, and a solder nonwetting region is formed on each of the one or more second pads.
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