MEMS MICROPHONE
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Dec 29, 2023
filing date -
Dec 29, 2023
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Abstract
A MEMS microphone includes substrate, housing, MEMS chip and ASIC chip. The substrate is provided with sound inlet channel communicating the receiving space with the outside. The MEMS chip includes diaphragm located on sound inlet path of sound inlet channel. The sound inlet channel includes buffering cavity, first sound inlet hole, and second sound inlet hole provided in the substrate and communicating the buffering cavity with the back cavity. The second sound inlet hole includes at least two sub-holes spaced apart from each other. When external air pressure enters the sound inlet channel, the air pressure entering from the first sound inlet hole may not directly act on the diaphragm through the second sound inlet hole, and the sub-holes can further block the airflow, which can effectively buffer the impact of the air pressure on the diaphragm, reduce diaphragm rupture, and improve reliability and performance of the MEMS microphone.
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