ANNULAR STRUCTURE FOR AN ELECTRONIC FLAME OFF WAND
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Jul 7, 2023
filing date -
Jul 7, 2023
priority date (Note) -
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Abstract
An annular structure for an electronic flame off (EFO) wand of a wire bonder is positioned beneath a capillary of the wire bonder. The annular structure provides uniform heat to a bond wire extending from the capillary to form a free air ball (FAB). Because heat is uniformly applied to the bond wire, the FAB is uniformly formed and is centered with respect to the capillary. The FAB is then bonded to a bond pad of a substrate. Because the FAB was uniformly formed and is centered on the capillary, the FAB will also be centered on the bond pad.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SANDISK TECHNOLOGIES INC | 951 SANDISK DRIVE LEGAL DEP MILPITAS CA 95035 |
International Classification(s)

- 2023 Application Filing Year
- H01L Class
- 19835 Applications Filed
- 4214 Patents Issued To-Date
- 21.25 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Ai, Pengchen | Shanghai, CN | 1 | 0 |
# of filed Patents : 1 Total Citations : 0 | |||
Chen, Jingyun | Shanghai, CN | 7 | 17 |
# of filed Patents : 7 Total Citations : 17 | |||
Chen, Lian | Shanghai, CN | 16 | 75 |
# of filed Patents : 16 Total Citations : 75 | |||
Guo, Xiaoting | Shanghai, CN | 2 | 9 |
# of filed Patents : 2 Total Citations : 9 | |||
Jiang, Guiyang | Shanghai, CN | 5 | 5 |
# of filed Patents : 5 Total Citations : 5 | |||
Li, Guangqiang | Shanghai, CN | 3 | 0 |
# of filed Patents : 3 Total Citations : 0 | |||
Liu, Yonglong | Shanghai, CN | 2 | 0 |
# of filed Patents : 2 Total Citations : 0 | |||
Qu, Wenbin | Shanghai, CN | 4 | 16 |
# of filed Patents : 4 Total Citations : 16 | |||
Zhang, Yuanheng | Shanghai, CN | 3 | 9 |
# of filed Patents : 3 Total Citations : 9 | |||
Zhu, Huijie | Shanghai, CN | 2 | 3 |
# of filed Patents : 2 Total Citations : 3 |
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Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- < 1 Age
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