INTERLINKED GROUND WELLS WITH SPECIALIZED PATTERNS FOR LIQUID METAL INTERPOSER

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20250014980A1
SERIAL NO

18219018

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Embodiments disclosed herein include a liquid metal interposer. In an embodiment, the liquid metal interposer comprises a substrate with a first opening in the substrate and a second opening in the substrate. In an embodiment, a channel is between the first opening and the second opening. In an embodiment, the channel fluidically couples the first opening to the second opening.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ERIKE, Eric Mesa, US 6 0
GIESSLER, Anikki Tempe, US 2 0
MONDAL, Saikat Chandler, US 6 14
NEKKANTY, Srikant Chandler, US 51 69
ZHANG, Zhichao Chandler, US 157 647

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