CHIP SYSTEM AND ELECTRONIC DEVICE
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Sep 18, 2024
filing date -
Sep 18, 2024
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Abstract
A chip system includes a BGA chip, a PCB, a signal source module, and a detection module. A function pin of the BGA chip is soldered to a function solder pad of the PCB by a first solder ball and a detection pin of the BGA chip is soldered to a detection solder pad of the PCB by a second solder ball. A designed life of the second solder ball is shorter than a designed life of the first solder ball. A detection path is formed between the BGA chip and the PCB and includes the second solder ball. The signal source module is configured to send a detection signal to the detection module through the detection path to determine a status of the detection path based on the received detection signal.
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