CORRECTION APPARATUS, EXPOSURE APPARATUS, COATER AND DEVELOPER APPARATUS, EXPOSURE SYSTEM, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Sep 19, 2024
filing date -
Sep 19, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A correction apparatus includes a mounting device configured to allow a wafer to be mounted thereon, a heating part configured to heat the wafer mounted on the mounting device, a force application part configured to apply a force to the wafer mounted on the mounting device, a first transport device configured to transport the wafer removed from the mounting device, and a controller configured to control the heating part and the force application part, wherein the controller performs shape correction on the wafer by the force application part applying a force to the wafer while the heating part heats the wafer, and the first transport device transports the wafer to which the shape correction has been performed.
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