PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION FOR BACK-END APPLICATIONS
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United States of America
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Jan 9, 2025
app pub date -
Nov 4, 2022
filing date -
Nov 4, 2022
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Abstract
A single platen Chemical Mechanical Planarization (CMP) process using a novel pad-in-a-bottle (PIB) technology and PIB type CMP slurries for back-end CMP application is described to replace multiple (such as three) platens Chemical Mechanical Planarization (CMP) process for back-end CMP applications. The single platen with a single polishing pad is used for the whole back-end CMP process comprising metal bulk, metal soft landing, and metal barrier CMP.
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