MULTI-DIMENSIONAL STRAIN SENSING DEVICE, METHOD FOR SENSING TYPES OF EXTERNAL MOTIONS AND FOR FORMING TERNARY VALUED LOGIC DEVICE BY THE SAME, AND TERNARY VALUED LOGIC SYSTEM
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United States of America
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Jan 9, 2025
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Jul 7, 2023
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Jul 7, 2023
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Abstract
A multi-dimensional strain sensing device includes a flexible substrate, two piezoelectric semiconducting films, a first pair of electrodes and a second pair of electrodes. The two piezoelectric semiconducting films are formed on opposite sides of the flexible substrate respectively. The first pair of electrodes are formed on one of the two piezoelectric semiconducting films and opposite to the flexible substrate. The second pair of electrodes are formed on the other one of the two piezoelectric semiconducting films and opposite to the flexible substrate. The present disclosure further proposes a method for sensing types of external motions by the multi-dimensional strain sensing device, a method for forming a ternary valued logic device by the multi-dimensional strain sensing device and a ternary valued logic system.
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