PHOTORESIST PATTERNING IN MULTI-DEPTH NANOWELLS
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United States of America
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Issued Date -
Jan 9, 2025
app pub date -
Jun 25, 2024
filing date -
Jun 25, 2024
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Abstract
Embodiments of the present disclosure relate to patterned substrates with functionalized surface such as flow cells, as well as methods of fabricating the patterned substrate. In particular, patterned substrates of the present disclosure may be prepared using two or more imprint resin layers, one of which acts as a photomask for the photoresist during substrate patterning, without the need of any metallic photomask. Embodiments of the patterned substrate may be used for simultaneous paired-end sequencing methods.
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