LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jan 19, 2024
filing date -
Jan 19, 2024
priority date (Note) -
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Abstract
A laterally placed capacitor package assembly and an assembly method thereof are provided. The laterally placed capacitor package assembly includes a wound capacitor package structure and a capacitor supporting structure. The wound capacitor package structure includes a wound assembly, a conductive assembly and a package assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The capacitor supporting structure includes a supporting portion configured to support the wound capacitor package structure and a plurality of positioning portions extending outward from the supporting portion. When the laterally placed capacitor package assembly is configured to be laterally disposed on a circuit substrate, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin can be laterally and electrically connected to the circuit substrate without bending.
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