PRINTED CIRCUIT BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Feb 27, 2024
filing date -
Feb 27, 2024
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a cavity; and a first barrier layer having at least a portion disposed between the first and second insulating layers and in contact with a side surface of at least a portion of the first wiring layer.
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