PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERIAL AND ELECTRONIC DEVICE INCLUDING THE SAME
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 26, 2024
filing date -
Jun 26, 2024
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Abstract
According to an embodiment, a printed circuit board (PCB) structure may include: a first PCB; an interposer; a second PCB; and a cover structure including a mounting layer which is connected to the second PCB and includes a base hole, a support layer which is on a surface of the mounting layer that faces away from the second PCB, and a visible layer which is connected to the support layer and includes a material having transparency.
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