INTEGRATED CIRCUIT INCLUDING BACKSIDE WIRING AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Mar 6, 2024
filing date -
Mar 6, 2024
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Abstract
An integrated circuit includes a plurality of standard cells on a front surface of a substrate and a backside wiring layer on a back surface of the substrate, where the plurality of standard cells include a first standard cell, the first standard cell includes a first P-type transistor and a first N-type transistor, the backside wiring layer includes a first backside wiring pattern configured to receive a first power supply voltage, a second backside wiring pattern configured to receive a second power supply voltage, and a third backside wiring pattern configured to receive a ground voltage, and the first standard cell at least partially overlaps the first backside wiring pattern, the second backside wiring pattern, and the third backside wiring pattern.
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